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Pulished Date December, 2021
ID: 12498
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3D IC Market Segmentation by Type (3D Stacked and True 3D); By Application (Memory, LED, MEMS, and Sensors); By Industry (IT & Telecommunication, Automotive, Consumer Electronics, Military & Defense, Healthcare, and Others) - Demand Analysis & Opportunity Outlook 2026

Pulished: December, 2021
ID: 12498
Pages: 175

3D IC Market Size, Growth, Trends & Forecast (2021 - 2026)

The market for 3D integrated circuits is predicted to grow at a 16.6% annual rate, from USD 6.48 billion in 2021 to USD 22.30 billion by 2026. 3D ICs (Integrated Circuits) increase market demand by improving efficiency, architecture design, form factor, power, cost, time-to-market, and risk in a technological and economic method.

A three-dimensional integrated circuit is abbreviated as 3D IC. It's made up of three-dimensional arrays of linked devices. It is made out of silicon wafers or dies and is a metal-oxide-semiconductor integrated circuit. It aids in improving operating efficiency while using less power and taking up less space. Both vertically and horizontally, the layers are intertwined. Typically, multi-layer chips are made by manufacturing distinct layers, stacking, then thinning them.

3D IC Market Recent Developments

Amkor Technology, a major supplier of semiconductor packaging and test services, has announced intentions to construct a cutting-edge smart plant in Bac Ninh, Vietnam. The new factory's initial phase will concentrate on offering Advanced System in Package (SiP) assembly and test solutions to the world's premier semiconductor and electronic manufacturing firms.

Samsung Electronics, a global leader in advanced semiconductor technology, today announced Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialised for semiconductors for high-performance and large-area packaging technology in HPC, AI, data centre, and network products.

RemoteMyApp, a Szczecin, Poland-based startup that provides cloud gaming solutions to businesses, has been bought by Intel for an undisclosed sum. Vortex.gg, a subscription-based cloud gaming service based on the IBM Cloud, charges $9.99 a month for 50 minutes of play in games like Fortnite, Grand Theft Auto V, and League of Legends.

Toshiba intends to split into three organisations as early as 2023, following a series of problems at the business, including the dismissal of the board's chairman and a contested takeover proposal. Within two years, the three groups, which will focus on infrastructure, devices, and semiconductor memory, will go public.

3D IC Market Drivers

High use of electronic devices, the rising need for the internet of things (IoT) technology, and technological advancements in 3D packaging technology are some of the major drivers driving the 3D IC market growth. The rapid advancement of 3D packaging technology has propelled the 3D IC market's revenue growth. 3D packaging's technological benefits fuel its demand in high-end applications such as computer chips, DRAMS, NAND, imaging and optoelectronics, memory, and others. The 3D IC industry is expected to rise as a result of increased investment and collaboration in R&D by leading outsourced semiconductor assembly and test (OSAT) businesses.

High-bandwidth memory (HBM) chips, which offer a high bandwidth while consuming less power, are also gaining popularity. The preference for HBM chips over GDDR5 chips will grow in the future years as the demand for more efficient memory chips grows. Several vendors have begun to favour HBMs, and one of the leading manufacturers has already announced the release of 32GB and 64GB HBM DRAM. HBM chips are high-density multi-die 3D ICs that can be linked to FPGAs, therefore their growing popularity will propel the 3D IC market forward.

3D IC Market Restraints

Despite the advantages and prospects that 3D ICs provide, they also present new issues that must be addressed. Many 3D IC projects have significant power and thermal issues. When it comes to powering the design, the power density per footprint is higher than for typical 2D chips.

The current technological restrictions are expected to pose hurdles to the 3D IC market. The shortage of experienced individuals or trained professionals will worsen the market's position and derail its growth rate. The high expenses associated with 3D IC technology may slow the market's expansion even more.

3D IC Market Segmentation

Type: The market is segmented into 3D Stacked and True 3D.

3D stacked integrated circuits (ICs) are integrated circuits that include two or more circuit layers in a single package, and they had a greater market share in 2020. These multi-layer chips are typically made by creating different layers and then stacking and thinning them together. Wafer-on-wafer, die-on-wafer, die-on-die, and combination stacking are all options. Stacking numerous dies on top of one another results in a chip that is smaller than one created by stacking them side by side. The small size of 3D-ICs is extremely useful in miniaturised devices, such as smartphones and Internet of Things applications. Because electronic impulses may flow quicker through thinner gaps between layers, 3D stacked devices have a maximum speed gain of roughly 5x over 2D systems.

Application: The market is segmented into Memory, LED, MEMS, and Sensors.

In 2020, the use of 3D ICs in sensors had a large market share. The key hurdles in the creation of sophisticated electronic devices, including sensor and sensor interface applications, are smaller form factors, extraordinary functionality, increased performance, and lower BOM. Smart sensor and sensor interface devices are designed for a variety of uses in Industry 4.0, Smart Cities, and the Internet of Things. In various chip-stacking technologies, BRDL and TSV are excellent alternatives to traditional gold wire bonding. For the development of 3D image sensor stacking technology, the sensor industry uses 3D silicon die stacking technology, and TSV technology enables for high-density interconnection of the wafers or dies.

Industry: The market is segmented into IT & Telecommunication, Automotive, Consumer Electronics, Military & Defense, Healthcare, and Others.

In 2020, consumer electronics accounted for the second-largest market share. Smartphones, tablets, computers, printers, smart televisions, digital cameras, and camcorders are examples of consumer electronic devices. A security lock, thermostat, fan controller, smart smoke detector, energy monitors, door and window sensors, and doorbell are just a few of the smart home gadgets available. These smart home gadgets are widely used as intelligent security systems, and they are expected to increase rapidly in the next years. The market for 3D ICs is being driven by the growing demand for highly efficient consumer electronics goods.

3D IC Market Regional Analysis

In 2020, the APAC market accounted for the highest market share, and it is predicted to grow at the fastest rate of 17.2 per cent over the forecast period. The market is developing due to factors such as the expanding telecom industry and rising demand for consumer electronics products. The region's dense population is a major factor in the growing sales of smart devices. Furthermore, the presence of major market players such as Samsung Electronics Co., Toshiba Corporation, and Sony Corporation, among others, is propelling the market in the area. In 2020, the European market had the second-largest market share, and it is expected to increase at a rate of 16.4% over the projected period. The North American market had the second-largest market share, and it is expected to increase at a rate of 16.0% over the forecast period.

3D IC Market Leader

Intel Corp is the largest 3D IC company in the world with a revenue of $75.7 billion and a market cap of $256.1 billion.

3D IC Market Key Players

  1. Taiwan Semiconductor Manufacturing Co Ltd (Taiwan)
  2. ASE Group (Taiwan)
  3. Qualcomm Inc (US)
  4. Broadcom Inc (US)
  5. Micron Technology (US)
  6. Texas Instruments (US)
  7. Nvidia (US)
  8. Amkor (US)
  9. STMicroelectronics (Switzerland)
  10. NXP Semiconductors (Netherlands)
  11. Samsung (South Korea)
  12. Toshiba (Japan)

Impact of COVID-19 for 3D IC Market

To minimise the spread of COVID-19 among persons, electronic manufacturing hubs have been temporarily shut down. This has had a significant impact on the 3D IC market's supply chain, resulting in material, component, and finished goods shortages. In the 3D IC industry, a lack of business continuity has had a substantial negative impact on revenue and shareholder returns, which is projected to cause financial disruptions. OEM production slowdowns and lower demand for mobile phones and other consumer electronics have slowed the growth of the 3D IC industry marginally.

1. Introduction                         

          1.1 Market Definition               

          1.2 Scope of the report            

          1.3 Study Assumptions            

          1.4 Base Currency, Base Year and Forecast Periods                  

2. Research Methodology                            

          2.1 Analysis Design                 

          2.2 Research Phases                

                    2.2.1 Secondary Research        

                    2.2.2 Primary Research  

                    2.2.3 Data Modelling     

                    2.2.4 Expert Validation  

          2.3 Study Timeline                   

3. Report Overview                             

          3.1 Executive Summary           

          3.2 Key Inferencees                  

4. Market Dynamics                           

          4.1 Impact Analysis                  

                    4.1.1 Drivers        

                    4.1.2 Restaints     

                    4.1.3 Opportunities       

          4.2 Regulatory Environment              

          4.3 Technology Timeline & Recent Trends            

5. Competitor Benchmarking Analysis                            

          5.1 Key Player Benchmarking            

                    5.1.1 Market share analysis     

                    5.1.2 Products/Service   

                    5.1.3 Regional Presence 

          5.2 Mergers & Acquistion Landscape          

          5.3 Joint Ventures & Collaborations            

6. Market Segmentation                    

          6.1 3D IC Market, By Type                 

                    6.1.1 3D Stacked

                    6.1.2 True 3D      

                    6.1.3 Market Size Estimations & Forecasts (2021-2026)

                    6.1.4 Y-o-Y Growth Rate Analysis    

                    6.1.5 Market Attractiveness Index    

          6.2 3D IC Market, By Application                

                    6.2.1 Memory       

                    6.2.2 LED   

                    6.2.3 MEMS

                    6.2.4 Sensors       

                    6.2.5 Market Size Estimations & Forecasts (2021-2026)

                    6.2.6 Y-o-Y Growth Rate Analysis    

                    6.2.7 Market Attractiveness Index    

          6.3 3D IC Market, By Industry            

                    6.3.1 IT & Telecommunication

                    6.3.2 Automotive 

                    6.3.3 Consumer Electronics     

                    6.3.4 Military & Defense

                    6.3.5 Healthcare  

                    6.3.6 Others         

                    6.3.7 Market Size Estimations & Forecasts (2021-2026)

                    6.3.8 Y-o-Y Growth Rate Analysis    

                    6.3.9 Market Attractiveness Index    

7. Geographical Landscape                          

          7.1 Global 3D IC Market, by Region            

          7.2 North America - Market Analysis (2021 - 2026)               

                    7.2.1 By Country  

                              7.2.1.1 USA

                              7.2.1.2 Canada

                    7.2.2 By Type       

                    7.2.3 By Application      

                    7.2.4 By Industry  

          7.3 Europe            

                    7.3.1 By Country  

                              7.3.1.1 UK

                              7.3.1.2 France

                              7.3.1.3 Germany

                              7.3.1.4 Spain

                              7.3.1.5 Italy

                              7.3.1.6 Rest of Europe

                    7.3.2 By Type       

                    7.3.3 By Application      

                    7.3.4 By Industry  

          7.4 Asia Pacific               

                    7.4.1 By Country  

                              7.4.1.1 China

                              7.4.1.2 India

                              7.4.1.3 Japan

                              7.4.1.4 South Korea

                              7.4.1.5 South East Asia

                              7.4.1.6 Australia & NZ

                              7.4.1.7 Rest of Asia-Pacific

                    7.4.2 By Type       

                    7.4.3 By Application      

                    7.4.4 By Industry  

          7.5 Latin America           

                    7.5.1 By Country  

                              7.5.1.1 Brazil

                              7.5.1.2 Argentina

                              7.5.1.3 Mexico

                              7.5.1.4 Rest of Latin America

                    7.5.2 By Type       

                    7.5.3 By Application      

                    7.5.4 By Industry  

          7.6 Middle East and Africa                 

                    7.6.1 By Country  

                              7.6.1.1 Middle East

                              7.6.1.2 Africa

                    7.6.2 By Type       

                    7.6.3 By Application      

                    7.6.4 By Industry  

8. Key Player Analysis                        

          8.1 Taiwan Semiconductor Manufacturing Co Ltd          

                    8.1.1 Business Description      

                    8.1.2 Products/Service   

                    8.1.3 Financials    

                    8.1.4 SWOT Analysis      

                    8.1.5 Recent Developments     

                    8.1.6 Analyst Overview  

          8.2 ASE Group                

          8.3 Qualcomm Inc                   

          8.4 Broadcom Inc           

          8.5 Micron Technology            

          8.6 Texas Instruments             

          8.7 Nvidia             

          8.8 Amkor            

          8.9 STMicroelectronics             

          8.10 NXP Semiconductors                  

          8.11 Samsung                

          8.12 Toshiba                  

9. Market Outlook & Investment Opportunities                        

Appendix                       

          List of Tables                 

          List of Figures                

  • Global, regional and country-level analysis and forecasts of the study market; providing Insights on the major countries/regions in which this industry is blooming and to also identify the regions that are still untapped
  • The segment-level analysis in terms of By Component, By Application, and along with market size forecasts and estimations to detect key areas of industry growth in detail
  • Identification of key drivers, restraints, opportunities, and challenges (DROC) in the market and their impact on shifting market dynamics
  • Study of the effect of exogenous and endogenous factors that affect the global market; which includes broadly demographics, economics, and political, among other macro-environmental factors presented in an extensive PESTLE Analysis
  • Study the microenvironment factors that determine the overall profitability of an Industry, using Porter’s five forces analysis for analyzing the level of competition and business strategy development
  • A comprehensive list of key market players along with with their product portfolio, current strategic interests, key financial information, legal issues, SWOT analysis and analyst overview to study and sustain the market environment
  • Competitive landscape analysis listing out the mergers, acquisitions, collaborations in the field along with new product launches, comparative financial studies and recent developments in the market by the major companies
  • An executive summary, abridging the entire report in such a way that decision-making personnel can rapidly become acquainted with background information, concise analysis, and main conclusions
  • Expertly devised analyst overview along with Investment opportunities to provide both individuals and organizations a strong financial foothold in the market
  1. Global 3D IC Market By Region, From 2021-2026 ( USD Billion )
  2. Global 3D IC Market By Type, From 2021-2026 ( USD Billion )
  3. Global 3D Stacked Market By Region, From 2021-2026 ( USD Billion )
  4. Global True 3D Market By Region, From 2021-2026 ( USD Billion )
  5. Global 3D IC Market By Application, From 2021-2026 ( USD Billion )
  6. Global Memory Market By Region, From 2021-2026 ( USD Billion )
  7. Global LED Market By Region, From 2021-2026 ( USD Billion )
  8. Global MEMS Market By Region, From 2021-2026 ( USD Billion )
  9. Global Sensors Market By Region, From 2021-2026 ( USD Billion )
  10. Global 3D IC Market By Industry, From 2021-2026 ( USD Billion )
  11. Global IT & Telecommunication Market By Region, From 2021-2026 ( USD Billion )
  12. Global Automotive Market By Region, From 2021-2026 ( USD Billion )
  13. Global Consumer Electronics Market By Region, From 2021-2026 ( USD Billion )
  14. Global Military & Defense Market By Region, From 2021-2026 ( USD Billion )
  15. Global Healthcare Market By Region, From 2021-2026 ( USD Billion )
  16. Global Others Market By Region, From 2021-2026 ( USD Billion )

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