Die Attach Equipment Market

Global Die Attach Equipment Market Size (2023 to 2028)

The global die attach equipment market is foreseen to progress at a CAGR of 6.1% from 2023 to 2028 and the global market size is anticipated to be worth USD 1909.3 million by 2028 from USD 1420 million in 2023.

In recent years, the interest in hybrid circuits has stayed solid as it has risen and there are existing applications in clinical, military, photonics, remote hardware, and so forth. The die-to-wafer hybrid holding stage allows the semiconductor business to extend beyond Moore's Law, giving uncommon 2.5D and 3D reconciliation adaptability needed for cutting-edge hardware. C2W half breed holding is the promising arising innovation that can empower direct Cu-Cu holding and can possibly swap TCB for the 3D stacked memory and very good quality rationale application.

Global Die Attach Equipment Market Drivers:

The increasing interest in the AuSn Eutectic Die-Attach method drives the worldwide market. Generally, different die attach items, which incorporate metal-filled conductive epoxies, high lead-containing binds, and gold-silicon welds, were adequate to mount the chip and have it perform dependably for the life of the gadget. The interest in discrete force gadgets also drives the worldwide market. The developing selection of copper cuts is rising as a substitute for more customary wire and lace holding. The bundling advances for discrete force gadgets incorporate die-attach work. The selection of wide-bandgap semiconductor die advancements (SiC and GaN) brings new inventive bundling arrangements, including silver sintering die-attach (materials incorporate epoxy shaping mixes and interconnection materials). The reformist changes from discrete SiC towards SiC modules in EV/HEV applications, the implanted die bundled frameworks, and the joining of GaN gadgets in multichip frameworks are only a couple of instances of such a pattern. This factor upgrades the interest of the die attach equipment for the discrete force gadgets.

Global Die Attach Equipment Market Restraints:

The pattern towards expanding heat age, interest in conservative gadgets, the establishment of RoHS and REACH enactment, and the change to GaAs chips restricted the utilization of customary materials. The interest in the high dependability of gadgets has driven specialists to assess different new materials for their die-attach equipment. However, mostly dimensional changes during processing and service life and mechanical unbalance of moving parts during handling through equipment challenge the usefulness.

Impact of COVID-19 on the die attach equipment market:

The effect of coronavirus doesn't profoundly influence the interest in die attached equipment. For example, in April 2020, Palomar Technologies declared that they are getting interested in assembling basic semiconductor parts to address COVID-19. They saw a speeding up of requests for their 3880 Die Bonder equipment to aid remote interchanges and systems administration data transfer capacity, distant medication, IoT in advanced technology, and the utilization of video conferencing. Also, inside the clinical devices market, their clients are quickly ramping up the creation of pressure sensors, which are significant parts utilized in respirators and ventilators, and this has brought about a flood of requests for their 8000i Wire Bonder. Consequently, generally, the interest in equipment has not dropped because of the pandemic.

REPORT COVERAGE:

This research report on the global die-attach equipment market has been segmented and sub-segmented into the following categories.

Die Attach Equipment Market - By Type:

• Die Bonder
• Flip Chip Bonder

Die Attach Equipment Market - By Application:

• Memory
• RF & MEMS 
• LED
• CMOS Image Sensor 
• Logic
• Optoelectronics/Photonics

Die attach material speaks to a vital part in the exhibition and unwavering quality of mid, high, and super-high force LEDs. With an expanding LED infiltration rate, the interest in die-attach equipment is expanding.

Die Attach Equipment Market - By Bonding Technique:

• Epoxy
• Eutectic
• Soft Solder
• Hybrid Bonding

Die Attach Equipment Market - By Region:

• North America
• Europe
• Asia-Pacific
• Latin America
• Middle East and Africa

Based on geography, Asia Pacific is foreseen to observe significant market development during the estimated time frame because of the expanding number of IDMs (Integrated Device Manufacturers) in the area. The large-scale manufacturing of electronic items, which incorporates cell phones, wearables, and white products, in China and Taiwan, utilizes a few gadgets, for example, optoelectronics, MEMS, and MOEMS. Every one of these gadgets requires die-attach equipment in the assembly process of these segments. Besides, India is additionally seeing development in various smart urban areas because of government activities and is required to incorporate electronic solutions for purposes such as observation, upkeep, checking, and so on. Over 60% of OSAT (Outsourced Semiconductor Assembly and Test) players present all over the world have their base camp in the APAC continent. These OSAT organizations use die-attach equipment in the semiconductor manufacturing process. Moreover, an expanding number of IDMs (Integrated Device Manufacturers) in the area is relied upon to support the market development very soon. Furthermore, South Korea, China, and generally Japan's mature age populace is foreseen to quicken the requirement for medical care services during the figure time frame, thus providing scope for devices, such as ventilators, dialysis, and blood pressure monitoring devices consisting of MEMS pressure sensors. The United Nations assesses that the geriatric populace in the area, matured 60 years and more established, could stretch around 606.55 million by 2020. This results in the development of the market because of the interest in die-attach equipment for MEMS pressure sensors.

KEY MARKET PLAYERS:

Anza Technology Inc, ASM Pacific Technology Limited, Be Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co Ltd, Inseto UK Limited, Kulicke and Soffa Industries, Inc, MicroAssembly Technologies, Ltd, Palomar Technologies, Inc, and Shinkawa Ltd are some of the key players in the global die-attach equipment market.

RECENT HAPPENINGS IN THE MARKET:

• In June 2019, ASM AMICRA dispatched another CoS (Chip-on-Submount) die-bonder, which won the 2019 Productronica Innovation Award. This new machine joins the organization's dynamic arrangement framework with the new taking care of advances and keeping in mind that contrasting with the business normal; it has fundamentally more limited process durations of 6 seconds.
• Walk 2020 - Electroninks declared that it is going into a key collaboration with Enjet Inc. to help progress the assembly of the show, touchpanel, and bundling items. Electroninks and Enjet will work together as a group to supply conductive ink printing at under 10um in a few markets, including miniature LED, scaled-down LED, EMI Shielding, and die-attach/interconnect applications.
• December 2019, Mitsubishi Electric Corporation dispatched the ML562G86 beat laser diode (LD) for projectors, highlighting an energetic 638-nanometer (nm) red light, the yield intensity of 3.0W under heartbeat activity and interim to failure1 (MTTF) of more than 20,000 hours. The headway in laser diode altogether builds interest in equipment, which measures the method of epoxy and electronic holding.