Bonding Films Market

Bonding Film Market Size, Share & Trends (2022 - 2027):

The Global Bonding Film Market is expected to witness moderate growth during the forecast period 2022 - 2027. The Global Bonding Film market was $721.17 million in 2022 and is expected to be around $1200.35 million in 2027 with a current CAGR of 10.31%.

Bonding Film Market Drivers & Restraints:

The increased usage of adhesives in high-end industries such as automobiles, electrical & electronics, Pharmaceuticals & construction has boosted the growth in the market.  The epoxy sector of the market is the major share contributor to the growth of the market. The epoxy bonding films have a uniform bond line thickness, therefore; they are preferred in industries where the large parts are expected to be bonded with high strength and accuracy such as in automobiles & construction industries. Recently, some adhesives are being used in the construction industry for bonding panels in slabs & beams. They show strong adhesive property & structural bonding. The use of bonding films in dental surgeries has also boosted the growth of the market. The Fluctuations in prices, expensive logistics & time-consuming process of the bonding films are some of the factors that are inhibiting the growth of the market.

REPORT COVERAGE:

Recent Developments:

• In recent research, a Universal Dental Adhesive (UA) has been developed for all dental surgeries. The manufacturers claim it to be universal as these adhesives can be used with any adhesion strategy and offer versatility with various direct – indirect restorative materials. The adhesive’s stability is dependent on the material & amount of exposure to hydrolytic degradation. Still, some long–term durability methods have to be figured out regarding the UA adhesive.

• Mechanical, Materials, and Aerospace Engineering, Illinois Institute of Technology, Chicago developing a tunable dielectric to improve electrostatic adhesion in electrostatic/microstructured adhesives. Adhesion is improved in microstructure adhesives when they are doped with highly polarizable material such as copper (II) Phthalocyanine. It was found that the dopant increased the relative permittivity of the base Elastomers by more than two times. The increase in dielectric's relative permittivity increases the electroadhesion force in a flat (non-microstructured) sample up to four times.

Bonding Film Market Segmentation:

By Type:

• Epoxy

• Acrylic

• Polyurethane

By Technology:

• (Thermally Cured

• Pressure Cured)

By End-Use:

• Industry (Electrical & Electronics,

• Transportation

• Packaging

Bonding Film Market Key Market Players:

1. Arkema S.A. (France)
2. H.B. Fuller (United States of America)
3. Hexcel Corporation (United States of America)
4. Gurit (Switzerland)
5. DuPont (United States of America)
6. Henkel AG & Co. KGaA (Germany)
7. 3M (United States of America)
8. Cytec Solvay Group (Belgium)
9. Hitachi Chemical Co., Ltd. (Japan)
10. Rogers Corporation (United States of America)