Market Overview
The Global Hermetic Packaging Market is envisioned to develop significantly during the calculated period. It is estimated that the target market is going to get valued around USD 5.84 billion by 2027 from USD 3.61 billion in 2019, growing at a CAGR of 6.7% over the prophesized period of 2020 to 2027.
Hermetic is a seal with gas-tight or impermeable for the flow of gas. But, when it comes to microelectronics, these hermetic are known as an airtight seal, which can keep moisture and other harmful gases getting penetrated from the sealed package.
The growing aerospace & defense industry is the major influencing factor of the global hermetic packaging market. Also, rising new fliers all around the world, owing to the cheaper airways availability along with the low cost of fuel, is fuelling the flying frequency. This rise in the frequency of flying is promoting the growth in Global Hermetic Packaging Market. Further, growth in the major companies investing in the research & development of defense and aerospace sectors is another fuel factor for the expansion of the application of this hermetic packaging.
Recent Developments
Drivers and Restraints of Global Hermetic Packaging Market
Increasing demand for products that are energy & hermetically packaged, majorly in the electronic components, and the growing application areas of this packaging in the sectors like aeronautics, electronics, space, and automobile components are the major drivers for the growth of the Global Hermetic Packaging Market. Moreover, another factor that was fuelling the growth of the target market during the forecast period is the rising advancements in the aeronautics & space industry.
However, the major restraint that was hindering the growth of hermetic packaging market is the policies in the military and the stringent regulation regarding the usage of this packaging.
Nonetheless, growing demand for packaging that is multilayer ceramic for the usage in high-frequency purposes which includes optical communication, wireless communication, and data communication is creating the lucrative growth opportunities for the expansion of the players in the Global Hermetic Packaging Market.
Market Segmentation of Global Hermetic Packaging Market
Based on the configuration outlook, the Global Hermetic Packaging market is segmented into Pressed Ceramic Packages, Multilayer Ceramic Packages, and Metal Can Packages.
And based on the type of product, the Global Hermetic Packaging market is segmented into Ceramic-Metal Sealing (CERTM), Glass-Metal Sealing (GTMS), Passivation Glass, Transponder Glass, and Reed Glass.
On the outlook of the industry, the Global Hermetic Packaging market is segmented into Military & Defense, Aeronautics & Space, Automotive, Energy & Nuclear Safety, Medical (Dental Applications, Veterinary Applications), Telecommunications, Consumer Electronics, Agriculture, Livestock Farming, and Others. Of these, the automotive segment is sub-segmented into Airbag Initiation, Battery Protection, and RFID Transponder Operation. The Energy & Nuclear Safety segment is sub-segmented into Electrical Penetration Control, Oil & Gas Applications, and Fuel Cell Manufacturing.
On the application segmentation, the Global Hermetic Packaging market is segmented as Transistors, Sensors, Lasers, Photodiodes, Airbag Initiators, Oscillating Crystals, MEMS Switches, Fiber Optic Components, and RF Connectors.
Global Hermetic Packaging Market Region wise analysis
In the regional analysis of the Global Hermetic Packaging Market, Asia Pacific's regional market held the major share of overall market revenue. The major factors that are driving the growth of the hermetic packaging market include the growing consumer electronics sector in this area, along with the rising government budgets for the advancements in the defense & aerospace sector in China, India, Japan, and the other East Asian countries.
North America Hermetic Packaging Market recorded the second-largest revenue in the global hermetic packaging market with a share of 28%. The key factor that is driving the growth of the target market in the North America area is the growing vital applications in the aeronautics & space sector. Also, the presence of the high number of aerospace companies in this region is anticipated to provide various growth opportunities for the target market in the locale. And the other factors that are augmenting the growth of hermetic packaging market in North America are the early technological adoptions in the region coupled with the intensification of R&D for the advancements in the aerospace industry. However, the major aspect hampering the growth of the market in North America is an active search for the substitute of this packaging due to their expensive prices.
Key Players of Global Hermetic Packaging Market
The key players of the Global Hermetic Packaging Market include Schott (Germany), Teledyne Microelectronics (US), Ametek (US), Texas Instruments (US), and Amkor Technology (US). Other major players in the hermetic packaging market include Kyocera (Japan), Materion (Japan), Egide (France), Micross Components (US), Legacy Technologies (US), Willow Technologies (UK), Intersil (Japan), SGA Technologies (UK), Complete Hermetics (US), SHP (US), Primoceler (Finland), Coat-X (Switzerland), Hermetics Solutions Group (US), Stratedge (US), and CHI (China).
1. Introduction
1.1 Market Definition
1.2 Scope of the report
1.3 Study Assumptions
1.4 Base Currency, Base Year and Forecast Periods
2. Research Methodology
2.1 Analysis Design
2.2 Research Phases
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Data Modelling
2.2.4 Expert Validation
2.3 Study Timeline
3. Report Overview
3.1 Executive Summary
3.2 Key Inferencees
4. Market Dynamics
4.1 Impact Analysis
4.1.1 Drivers
4.1.2 Restaints
4.1.3 Opportunities
4.2 Regulatory Environment
4.3 Technology Timeline & Recent Trends
5. Competitor Benchmarking Analysis
5.1 Key Player Benchmarking
5.1.1 Market share analysis
5.1.2 Products/Service
5.1.3 Regional Presence
5.2 Mergers & Acquistion Landscape
5.3 Joint Ventures & Collaborations
6. Market Segmentation
6.1 Hermetic Packaging Market, By Configuration
6.1.1 Pressed Ceramic Packages
6.1.2 Multilayer Ceramic Packages
6.1.3 Metal Can Packages
6.1.4 Market Size Estimations & Forecasts (2019-2024)
6.1.5 Y-o-Y Growth Rate Analysis
6.1.6 Market Attractiveness Index
6.2 Hermetic Packaging Market, By Type
6.2.1 Ceramic-Metal Sealing/CERTM
6.2.2 Glass-Metal Sealing/GTMS
6.2.3 Passivation Glass
6.2.4 Transponder Glass
6.2.5 Reed Glass
6.2.6 Market Size Estimations & Forecasts (2019-2024)
6.2.7 Y-o-Y Growth Rate Analysis
6.2.8 Market Attractiveness Index
6.3 Hermetic Packaging Market, By Application
6.3.1 Transistors
6.3.2 Sensors
6.3.3 Lasers
6.3.4 Photodiodes
6.3.5 Airbag Initiators
6.3.6 Oscillating Crystals
6.3.7 MEMS Switches
6.3.8 Fiber Optic Components
6.3.9 RF Connectors
6.3.10 Market Size Estimations & Forecasts (2019-2024)
6.3.11 Y-o-Y Growth Rate Analysis
6.3.12 Market Attractiveness Index
6.4 Hermetic Packaging Market, By Industry
6.4.1 Military & Defense
6.4.2 Aeronautics & Space
6.4.3 Automotive
6.4.4 Energy & Nuclear Safety
6.4.5 Oil & Gas Applications
6.4.6 Medical
6.4.7 Telecommunications
6.4.8 Consumer Electronics
6.4.9 Agriculture
6.4.10 Livestock Farming
6.4.11 Market Size Estimations & Forecasts (2019-2024)
6.4.12 Y-o-Y Growth Rate Analysis
6.4.13 Market Attractiveness Index
7. Geographical Landscape
7.1 Global Identity Governance and Administration Market, by Region
7.2 North America - Market Analysis (2018 - 2024)
7.2.1 By Country
7.2.1.1 USA
7.2.1.2 Canada
7.2.2 By Configuration
7.2.3 By Type
7.2.4 By Application
7.2.5 By Industry
7.3 Europe
7.3.1 By Country
7.3.1.1 UK
7.3.1.2 France
7.3.1.3 Germany
7.3.1.4 Spain
7.3.1.5 Italy
7.3.1.6 Rest of Europe
7.3.2 By Configuration
7.3.3 By Type
7.3.4 By Application
7.3.5 By Industry
7.4 Asia Pacific
7.4.1 By Country
7.4.1.1 China
7.4.1.2 India
7.4.1.3 Japan
7.4.1.4 South Korea
7.4.1.5 South East Asia
7.4.1.6 Australia & NZ
7.4.1.7 Rest of Asia-Pacific
7.4.2 By Configuration
7.4.3 By Type
7.4.4 By Application
7.4.5 By Industry
7.5 Latin America
7.5.1 By Country
7.5.1.1 Brazil
7.5.1.2 Argentina
7.5.1.3 Mexico
7.5.1.4 Rest of Latin America
7.5.2 By Configuration
7.5.3 By Type
7.5.4 By Application
7.5.5 By Industry
7.6 Middle East and Africa
7.6.1 By Country
7.6.1.1 Middle East
7.6.1.2 Africa
7.6.2 By Configuration
7.6.3 By Type
7.6.4 By Application
7.6.5 By Industry
8. Key Player Analysis
8.1 Schott
8.1.1 Business Description
8.1.2 Products/Service
8.1.3 Financials
8.1.4 SWOT Analysis
8.1.5 Recent Developments
8.1.6 Analyst Overview
8.2 Teledyne Microelectronics
8.3 Ametek
8.4 Texas Instruments
8.5 Amkor Technology
8.6 Kyocera
8.7 Materion
8.8 Egide
8.9 Micross Components
8.10 Legacy Technologies
9. Market Outlook & Investment Opportunities
Appendix
List of Tables
List of Figures
