The size of the Semi-Conductor and IC Packaging Materials Market was around USD 30.92 Billion by revenue, at the end of 2020. It is expected to grow at a CAGR of 8.85% to reach close to USD 41.75 Billion by the end of 2026. The growth of the global semiconductor and IC packaging materials market is majorly driven by the advancement of technology and the need for better sustainable semiconductors and IC protections.
World’s largest semiconductor exhibition and conference, SEMICON China 2019, has opened on March 19, 2019. The conference has raised hopes for dual opportunities for the manufactures of semiconductors and ICs. This is expected to provide a platform to exchange technology across the world.
Drivers and Restraints
The market for IC and semiconductors packaging materials is mainly driven by the advancement of technology in the fast-developing world. The growth in the organic substrates for the use of packaging is a critical driver to the growth of the market for semiconductors and IC packaging materials. However, the concentration of the market in North American and the Asia Pacific Region may restrain the market expansion in the African and Latin American regions. Also, the complications which arise when dealing with small electronics ICs and semiconductors decelerate the pace of market growth.
Market Size Available
2020 – 2026
2022 - 2027
By Type, Packaging Technologies and Region
Various Analyses Covered
Global, Regional & Country Level Analysis, Segment-Level Analysis, DROC, PESTLE Analysis, Porter’s Five Forces Analysis, Competitive Landscape, Analyst Overview on Investment Opportunities
North America, Europe, APAC, Latin America, Middle East & Africa
Market Leaders Profiled
BASF SE (Germany),LG Chemical Ltd,Hitachi Chemical Co. Ltd,Toray Industries Corporation (Japan),Alent plc (U.K.),Amkor Technology (US),STATS ChipPAC Ltd. (Singapore),Sumitomo Chemical Co. Ltd. (Japan),Tanaka Holdings Co. Ltd. (Japan),Kyocera Chemical Co. Ltd. (Japan) and Others.
This global market research report is segmented and sub-segmented as following:
Among these, the organic substrates segment has a significant share in the semiconductor and IC packaging materials market in terms of both value and volume. The extensive use of organic substrates as a base material for semiconductors is the main reason for the growth of this segment in the market. The bonding wires used are majorly made of gold which is hard to continue as the cost efficiency of organic substrates is higher when compared to others.
As of 2018, the SOP segment is estimated to be the highest value holder and the fastest-growing when compares to other technologies.
North America Semi-Conductor and IC Packaging Materials Market leads the global market by both value and volume, as of 2018. The situation of all the market key players in this region is the main reason for its leading market position. However, this region is only the second-fastest growing in the world following the Asia Pacific region.
Europe Semi-Conductor and IC Packaging Materials Market is second in the lead in the year 2018. The presence of a vast customer base in and around this region is helping in the growth of the market in Europe.
Asia Pacific (APAC) Semi-Conductor and IC Packaging Materials Market is the next largest market shareholder in the year 2018, in terms of value and volume. This region is expected to be the fastest-growing regional market for Semi-Conductor and IC Packaging Materials owing to the future opportunities offered in this region and interest shown from the top leading key companies in the Asia Pacific region, mainly towards India, China, and Japan which is the cause for such growth rate. The regional advantages offered this region, such as ease of setup and cheap resources, and a large number of skilled population is a significant reason for this region’s advancement in the market.
On the other hand, the Middle-East & Africa and Latin America regions, being in the low developing countries due to the contribution of low GDP countries, have fewer chances for industry growth. Hence, the Semi-Conductor and IC Packaging Materials Market in these regions is slow-growing in nature.
Key Market Players:
1.1 Market Definition
1.2 Scope of the report
1.3 Study Assumptions
1.4 Base Currency, Base Year and Forecast Periods
2. Research Methodology
2.1 Analysis Design
2.2 Research Phases
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Data Modelling
2.2.4 Expert Validation
2.3 Study Timeline
3. Report Overview
3.1 Executive Summary
3.2 Key Inferencees
4. Market Dynamics
4.1 Impact Analysis
4.2 Regulatory Environment
4.3 Technology Timeline & Recent Trends
5. Competitor Benchmarking Analysis
5.1 Market Share Analysis
5.2 Product Benchmarking
5.3 Regional Presence
5.4 Mergers & Acquistion Landscape
5.5 Joint Ventures & Collaborations
6. Market Segmentation
6.1 Semiconductor & IC Packaging Materials Market, by Types
6.1.1 Lead frames
6.1.2 Organic Substrates
6.1.3 Ceramic Packages
6.1.4 Bonding Wires
6.1.6 Market Size Estimations & Forecasts (2022 - 2027)
6.1.7 Y-o-Y Growth Rate Analysis
6.1.8 Market Attractiveness Index
6.2 Semiconductor & IC Packaging Materials Market, by Packaging Technologies
6.2.6 Market Size Estimations & Forecasts (2022 - 2027)
6.2.7 Y-o-Y Growth Rate Analysis
6.2.8 Market Attractiveness Index
7. Geographical Landscape
7.1 Global Identity Governance and Administration Market, by Region
7.2 North America - Market Analysis (2021 - 2027)
7.2.1 By Country
7.2.2 By Types
7.2.3 By Packaging Technologies
7.2.4 Y-o-Y Growth Rate Analysis
7.2.5 Market Attractiveness Index
7.3.1 By Country
22.214.171.124 Rest of Europe
7.3.2 By Types
7.3.3 By Packaging Technologies
7.3.4 Y-o-Y Growth Rate Analysis
7.3.5 Market Attractiveness Index
7.4 Asia Pacific
7.4.1 By Country
126.96.36.199 South Korea
188.8.131.52 South East Asia
184.108.40.206 Australia & NZ
220.127.116.11 Rest of Asia-Pacific
7.4.2 By Types
7.4.3 By Packaging Technologies
7.4.4 Y-o-Y Growth Rate Analysis
7.4.5 Market Attractiveness Index
7.5 Latin America
7.5.1 By Country
18.104.22.168 Rest of Latin America
7.5.2 By Types
7.5.3 By Packaging Technologies
7.5.4 Y-o-Y Growth Rate Analysis
7.5.5 Market Attractiveness Index
7.6 Middle East and Africa
7.6.1 By Country
22.214.171.124 Middle East
7.6.2 By Types
7.6.3 By Packaging Technologies
7.6.4 Y-o-Y Growth Rate Analysis
7.6.5 Market Attractiveness Index
8. Key Player Analysis
8.1 BASF SE
8.1.1 Business Description
8.1.4 SWOT Analysis
8.1.5 Recent Developments
8.1.6 Analyst Overview
8.2 LG Chemical Ltd.
8.3 Hitachi Chemical Co. Ltd.
8.4 Toray Industries Corporation
8.5 Alent plc
8.6 Amkor Technology
8.7 STATS ChipPAC Ltd.
8.8 Sumitomo Chemical Co. Ltd.
8.9 Tanaka Holdings Co. Ltd.
8.10 Kyocera Chemical Co. Ltd.
9. Market Outlook & Investment Opportunities
List of Tables
List of Figures
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