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Global Semi-Conductor and IC Packaging Materials Market Size, Share, Trends, COVID-19 Impact & Growth Forecast Report – Segmented By Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and Others), Packaging Technologies (SOP, GA, QFN, DFN,andOthers), and Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Industry Analysis (2024 to 2029)

Published: March, 2023
ID: 8338
Pages: 170
Formats: report pdf report excel report power bi report ppt

Global Semi-Conductor and IC Packaging Materials Market Size (2024 to 2029):

The global Semi-Conductor and IC Packaging Materials Market is predicted to reach USD 43.41 billion in 2024 and USD 66.33 billion by 2029, growing at a CAGR of 8.85% during the forecast period.

The growth of the global semiconductor and IC packaging materials market is majorly driven by the advancement of technology and the need for better sustainable semiconductors and IC protections. World’s largest semiconductor exhibition and conference, SEMICON China 2019, has opened on March 19, 2019. The conference has raised hopes for dual opportunities for the manufactures of semiconductors and ICs. This is expected to provide a platform to exchange technology across the world. The market for IC and semiconductors packaging materials is mainly driven by the advancement of technology in the fast-developing world. The growth in the organic substrates for the use of packaging is a critical driver to the growth of the market for semiconductors and IC packaging materials. However, the concentration of the market in North American and the Asia Pacific Region may restrain the market expansion in the African and Latin American regions. Also, the complications which arise when dealing with small electronics ICs and semiconductors decelerate the pace of market growth.

GLOBAL SEMI-CONDUCTOR AND IC PACKAGING MATERIALS MARKET REPORT COVERAGE:

REPORT METRIC

DETAILS

Market Size Available

2023 to 2029

Base Year

2023

Forecast Period

2024 to 2029

CAGR

8.85%

Segments Covered

By Type, Packaging Technologies and Region

 

Various Analyses Covered

Global, Regional & Country Level Analysis, Segment-Level Analysis, DROC, PESTLE Analysis, Porter’s Five Forces Analysis, Competitive Landscape, Analyst Overview on Investment Opportunities

Regions Covered

North America, Europe, APAC, Latin America, Middle East & Africa

 

 

Market Leaders Profiled

BASF SE (Germany),LG Chemical Ltd,Hitachi Chemical Co. Ltd,Toray Industries Corporation (Japan),Alent plc (U.K.),Amkor Technology (US),STATS ChipPAC Ltd. (Singapore),Sumitomo Chemical Co. Ltd. (Japan),Tanaka Holdings Co. Ltd. (Japan),Kyocera Chemical Co. Ltd. (Japan) and Others.

 

This global market research report is segmented and sub-segmented based on the type, packaging technologies, and region.

Global Semi-Conductor and IC Packaging Materials Market - By Types:

  • Lead frames

  • Organic Substrates

  • Ceramic Packages

  • Bonding Wires and Others.

Among these, the organic substrates segment has a significant share in the semiconductor and IC packaging materials market in terms of both value and volume. The extensive use of organic substrates as a base material for semiconductors is the main reason for the growth of this segment in the market. The bonding wires used are majorly made of gold which is hard to continue as the cost efficiency of organic substrates is higher when compared to others.

Global Semi-Conductor and IC Packaging Materials Market - By Packaging Technologies:

  • SOP

  • GA

  • QFN

  • DFN and Others.

As of 2018, the SOP segment is estimated to be the highest value holder and the fastest-growing when compares to other technologies.

Global Semi-Conductor and IC Packaging Materials Market - By Region:

  • Europe

  • Latin America

  • Asia Pacific

  • North America

  • Middle-East and Africa.

North America Semi-Conductor and IC Packaging Materials Market leads the global market by both value and volume, as of 2018. The situation of all the market key players in this region is the main reason for its leading market position. However, this region is only the second-fastest growing in the world following the Asia Pacific region.

Europe Semi-Conductor and IC Packaging Materials Market is second in the lead in the year 2018. The presence of a vast customer base in and around this region is helping in the growth of the market in Europe.

Asia Pacific (APAC) Semi-Conductor and IC Packaging Materials Market is the next largest market shareholder in the year 2018, in terms of value and volume. This region is expected to be the fastest-growing regional market for Semi-Conductor and IC Packaging Materials owing to the future opportunities offered in this region and interest shown from the top leading key companies in the Asia Pacific region, mainly towards India, China, and Japan which is the cause for such growth rate. The regional advantages offered this region, such as ease of setup and cheap resources, and a large number of skilled population is a significant reason for this region’s advancement in the market.

On the other hand, the Middle-East & Africa and Latin America regions, being in the low developing countries due to the contribution of low GDP countries, have fewer chances for industry growth. Hence, the Semi-Conductor and IC Packaging Materials Market in these regions is slow-growing in nature.

KEY MARKET PARTICIPANTS:

The major companies operating in the global semi-conductor and ic packaging market include BASF SE (Germany), LG Chemical Ltd., Hitachi Chemical Co. Ltd., Toray Industries Corporation (Japan), Alent plc (U.K.), Amkor Technology (US), STATS ChipPAC Ltd. (Singapore), Sumitomo Chemical Co. Ltd. (Japan), Tanaka Holdings Co. Ltd. (Japan), Kyocera Chemical Co. Ltd. (Japan) and Others

 

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FAQ's

What factors are influencing the demand for semiconductor and IC packaging materials on a global scale?

Factors such as the growing demand for consumer electronics, the proliferation of IoT devices, and advancements in semiconductor technology are driving the demand for packaging materials globally.

What are the key challenges faced by the Semiconductor and IC Packaging Materials Market globally?

Challenges such as fluctuating raw material prices, stringent regulatory requirements, and the need for continuous technological advancements pose significant hurdles for market players globally.

How is the rise of electric vehicles (EVs) impacting the Semiconductor and IC Packaging Materials Market on a global scale?

The increasing adoption of electric vehicles necessitates the use of power semiconductor devices, driving the demand for advanced packaging materials capable of withstanding high temperatures and power densities.

What are the emerging trends shaping the future of the Semiconductor and IC Packaging Materials Market globally?

Emerging trends such as the adoption of advanced packaging technologies like 3D packaging, the integration of AI and machine learning in packaging processes, and the rise of heterogeneous integration are poised to reshape the market landscape in the coming years.

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