The global FinFET technology market size was valued at USD 50.88 billion in 2023. The global market is further anticipated to grow at a CAGR of 40.4% from 2024 to 2029 and be worth USD 389.72 billion by 2029 from USD 71.44 billion in 2024.
FinFET Technology, the abbreviated form of Fin Field Effect Transistor, is a technology that is built on 3D transistors for designing modern processors for smartphones, computers, TVs, tablets, and other wearable devices. The name FinFET came from its design which is like the back fin of the fish. In the initial stages of FinFET's existence, they were built on SOI(Silicon-on-Insulator) wafers. Technological improvements have made these FinFETs made on bulk silicon wafers and enabled them to perform them in various parameters. These FinFETs' architecture includes two gates, which can be connected or unplugged.
The technological advancements of these FinFETs like building them bulk silicon wafers are improving their performance, thus, encouraging the electronics manufacturers to adopt them. Moreover, growth in the usage of smartphones, laptops, and other wearables is one of the core factors that is propelling the global FinFET technology market.
The FinFET Technology market is a fast-growing market that is majorly driven by the demand from end-use industries like smartphones and wearables. The rising demand from the end-user industries for miniaturized semiconductors and increased device performance is the key factor driving the global FinFET Technology Market. The fact that gate terminals in FinFET are operated and shorted separately helps improve the application processors’ performance by controlling the threshold voltage between the gates. Also, the growing demand for smartphones and wearables incorporated with FinFET technology, and high-performance chips are the major factors contributing to the growth of the market globally. Although the market has already been very competitive, an increase in the usage of smartphones, laptops, and growing technology is creating opportunities for the growth of this FinFET Technology Market. Additionally, developing the advancements in the way of building them can create an opening for the new players in this competitive market.
However, in contrast to the commonly known positive factors, complexity in manufacturing and self-heating issues are some of the factors that hinder the growth of the global FinFET Technology Market.
REPORT METRIC |
DETAILS |
Market Size Available |
2023 to 2029 |
Base Year |
2023 |
Forecast Period |
2024 to 2029 |
CAGR |
40.4% |
Segments Covered |
By Technology, Product, End User and Region |
Various Analyses Covered |
Global, Regional & Country Level Analysis, Segment-Level Analysis, DROC, PESTLE Analysis, Porter’s Five Forces Analysis, Competitive Landscape, Analyst Overview of Investment Opportunities |
Regions Covered |
North America, Europe, APAC, Latin America, Middle East & Africa |
Market Leaders Profiled |
Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Intel Corporation (US), Samsung Electronics Corporation Ltd (South Korea), GLOBALFOUNDRIES (US), Xilinx, Inc. (US), Qualcomm Technologies Inc. (US), ARM Limited (UK), MediaTek, Incorporated (Taiwan), Semiconductor Manufacturing International Corp. (China), Atomera, Inc. (US), Huawei Technologies Co. Ltd (China), Apple Inc. (US), Broadcom Inc. (US), NVIDIA Corporation (US), United Microelectronics Corporation (Taiwan) and Advanced Micro Devices (AMD) Inc. (US) |
Among the mentioned technologies, the 10mn segment is anticipated to be the segment to grow with a significant CAGR during the forecast period. The 10mn technology is of use in various server applications and smartphones, which incorporates high screen resolution and faster processors, as it improves performance by 10-20%. The 7nm technology segment provides the most competitive logic density, due to which it is expected to register the highest CAGR over the foreseen period followed by 14nm section that is known for its ideal power efficiency and high-performance system.
The GPU segment has accounted for the largest share in the global market. The evolving research resulting in the innovative use of technology is the main reason for the growth of this segment.
Among the mentioned end-users, Smartphones and Wearables are calculated to augment with the fastest growth rate in the forecast period. Technological advancements and the rising demand for innovative products are the reason for its rapid growth in the global FinFET Technology market. This segment is currently leading the market and is anticipated to continue during the forecast period.
The North American region is predicted to lead the global market both in terms of value and volume. This is due to the situation of growing smartphone owners and the development of new technologies like machine learning and artificial intelligence, which is, in turn, driving the demand for FinFET technology in different end-use applications.
Asia-Pacific is next in the lead for the global FinFET Technology market followed by Europe. The high potential in the Asia Pacific region for future opportunities caused due to fast industrialization and urbanization, mainly in countries like India, Japan, and China, is the primary reason for its booming market values in FinFET Technology.
Companies that play a prominent role in the global FinFET technology market include Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Intel Corporation (US), Samsung Electronics Corporation Ltd (South Korea), GLOBALFOUNDRIES (US), Xilinx, Inc. (US), Qualcomm Technologies Inc. (US), ARM Limited (UK), MediaTek, Incorporated (Taiwan), Semiconductor Manufacturing International Corp. (China), Atomera, Inc. (US), Huawei Technologies Co. Ltd (China), Apple Inc. (US), Broadcom Inc. (US), NVIDIA Corporation (US), United Microelectronics Corporation (Taiwan) and Advanced Micro Devices (AMD) Inc. (US).
By Technology
By Product
By End-User
By Region
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