The DRAM Module and Components Market was worth US$ 94.9 billion in 2021 and is projected to reach the valuation of US$ 110.7 billion by 2027 and is predicted to register a CAGR of 1.2% from 2022-to 2027.
Memory is the most basic requirement for computer operation. Its ability to run sets of instructions and store working data is enhanced when it is paired with a CPU. The power of Random Reach Memory (RAM) to access any position in memory with nearly the same time delay has made it famous. DRAM stands for dynamic access memory, which is a type of random-access memory that allows for larger densities at a cheaper cost. Laptops and desktop computers use these memory modules.
A transistor and a capacitor make up a single DRAM cell. A single memory chip can hold billions of these components, making them incredibly compact. Due to the dynamic nature of memory cells, DRAM requires a substantial amount of power. DRAM is used in Mobile Devices, Personal Computers, Consumer Electronics, and Networking Devices and is available in a variety of memory ranges.
The advent of 5G technology, increased demand for DRAM modules and components in the automotive industry, and increased adoption of high-end smartphones are some of the important reasons driving the growth of the DRAM module and components.
The COVID-19 epidemic has wreaked havoc on the supply chains of mobile devices, computers, and consumer electronics, which are the primary end-user industries for DRAM modules and components. Lockdowns and the halting of production activities have impeded economic growth, upended the global semiconductor industry and caused a massive chip shortage that has impacted autos, computers, and other businesses worldwide. Despite this, the deficit has created an opportunity for investment and the rise of new participants in the semiconductor business; semiconductor manufacturers are now striving to increase production.
The expansion of the DRAM market is fuelled by introducing new computing devices such as ultra-thin notebooks and hybrid devices, technological advancements, and the widespread use of DRAM in devices.
The introduction of the 5G cellular network has added more lanes to the information superhighway, allowing massive volumes of data to travel quicker and more freely, lessening traffic congestion. 5G, enabled by advances in memory and storage, when combined with next-generation technologies like artificial intelligence (AI), has the potential to convert mobile gadgets into foresightful, intuitive, and brilliant companions. The 5G/AI revolution will alter how people communicate, work, consume, recreate, and experience the world.
In the coming years, 5G technology will integrate new capabilities into mobile devices, such as storage capacities ranging from 512GB to 1TB, data transmission speeds of up to 20Gbps, and bandwidths allowing simultaneous connections to multiple devices, such as sensors and other "smart" devices like autonomous vehicles. 5G wireless technology's fast processing speed, low latency, large bandwidth, and massive storage capacity are expected to bring mobile devices' intelligence up to par with that of the human brain.
Stability at high temperatures and in harsh environments is one of the most important requirements for new memory technologies. Some memory is stable and performs well in extreme temperatures. As a result, they're used in a variety of applications in which they're subjected to extremely high and low temperatures. However, in such high environmental conditions, sure scalability and stability concerns arise in the operation of most memory.
Elevated temperatures hurt reliability. DRAM thermal issues are compounded by designers cramming more DRAM chips into overcrowded DIMMs. Physical constraints limit the DIMM pitch and thermal solutions that can be used. Furthermore, the dense and homogeneous positioning of memory components on the DIMM makes effective heat distribution difficult. As a result, heat accumulates more quickly within the packed DIMM.
Another factor to consider is the operating temperature. Because different countries have varied climates and extreme weather events, DRAM products must have a considerably more comprehensive temperature range with a higher and lower threshold than other DRAM product categories to make sure that devices do not break down in the middle.
DDR stands for Double Data Rate, and it is the next generation of SDRAM that transfers data on rising-falling edges of the clock signal to obtain more bandwidth than the previous generation, single data rate (SDRAM). DDR5 DRAMs are predicted to grow faster in the DRAM module and components market during the forecast period. It is the quickest SDRAM on the market today, making it ideal for PC enthusiasts, serious gamers, and content creators seeking next-generation performance, expanded capacity, and power efficiency. As a result, demand is higher.
Due to the rising applications of DRAM modules and components in modern vehicles for features like infotainment, ADAS, telematics, and D-clusters, the autos segment is predicted to develop at the fastest rate over the forecast period (digital instrument clusters).
Due to the increasing applications of these DRAMs in resource-heavy applications, such as image or video processing (even 4K video), CAD, or 3D modelling, and/or virtual machines, the above 8GB memory segment is projected to have the largest market share in the DRAM module and components market during the forecast period. Furthermore, video editing and other multimedia will be more effective with more DRAM. Having more than 8GB is particularly useful if the user uses virtualization software like Microsoft Hyper-V or VMware Workstation extensively, especially if numerous virtual machines are running simultaneously.
Due to the presence of nations such as China and South Korea in the area, APAC currently owns the most significant market share of DRAM modules and components and is likely to maintain this position during the projection period. China is an important market for memory devices, with substantial growth due to high demand in the mobile, automotive, and server markets, although it relies on other countries to meet its DRAM needs. The Chinese government with the launch of "Made in China 2025" in 2015, in 2015 collaborated with private sector partners, began investing billions of dollars in developing their domestic semiconductor industry, with the goal of closing the gap between domestic production and demand.
The market for DRAM modules and components in North America is predicted to increase rapidly. All memory technology manufacturers have their headquarters in this region. The region is a significant computer industry hub, with strong R&D support and substantial financial backing, resulting in high memory usage. Consumer gadgets like smart home devices, smart wearables, and gaming consoles are all popular in the region. One of the major reasons for the growth of the DRAM module and components market in the area is the presence of some of the leading players in the industry, such as Micron Technology, Inc., Kingston Technology Corporation, and SMART Modular Technologies.
1.1 Market Definition
1.2 Scope of the report
1.3 Study Assumptions
1.4 Base Currency, Base Year and Forecast Periods
2. Research Methodology
2.1 Analysis Design
2.2 Research Phases
2.2.1 Secondary Research
2.2.2 Primary Research
2.2.3 Data Modelling
2.2.4 Expert Validation
2.3 Study Timeline
3. Report Overview
3.1 Executive Summary
3.2 Key Inferencees
4. Market Dynamics
4.1 Impact Analysis
4.2 Regulatory Environment
4.3 Technology Timeline & Recent Trends
5. Competitor Benchmarking Analysis
5.1 Key Player Benchmarking
5.1.1 Market share analysis
5.1.3 Regional Presence
5.2 Mergers & Acquistion Landscape
5.3 Joint Ventures & Collaborations
6. Market Segmentation
6.1 DRAM Module and Components Market , By Technology
6.1.7 Market Size Estimations & Forecasts (2022-2027)
6.1.8 Y-o-Y Growth Rate Analysis
6.1.9 Market Attractiveness Index
6.2 DRAM Module and Components Market , By End-User Industries
6.2.3 Mobile Devices
6.2.4 Consumer Electronics
6.2.6 Market Size Estimations & Forecasts (2022-2027)
6.2.7 Y-o-Y Growth Rate Analysis
6.2.8 Market Attractiveness Index
6.3 DRAM Module and Components Market , By Memory
6.3.1 above 8GB
6.3.5 Market Size Estimations & Forecasts (2022-2027)
6.3.6 Y-o-Y Growth Rate Analysis
6.3.7 Market Attractiveness Index
7. Geographical Landscape
7.1 Global DRAM Module and Components Market , by Region
7.2 North America - Market Analysis (2022-2027)
7.2.1 By Country
7.2.2 By Technology
7.2.3 By End-User Industries
7.2.4 By Memory
7.3.1 By Country
188.8.131.52 Rest of Europe
7.3.2 By Technology
7.3.3 By End-User Industries
7.3.4 By Memory
7.4 Asia Pacific
7.4.1 By Country
184.108.40.206 South Korea
220.127.116.11 South East Asia
18.104.22.168 Australia & NZ
22.214.171.124 Rest of Asia-Pacific
7.4.2 By Technology
7.4.3 By End-User Industries
7.4.4 By Memory
7.5 Latin America
7.5.1 By Country
126.96.36.199 Rest of Latin America
7.5.2 By Technology
7.5.3 By End-User Industries
7.5.4 By Memory
7.6 Middle East and Africa
7.6.1 By Country
188.8.131.52 Middle East
7.6.2 By Technology
7.6.3 By End-User Industries
7.6.4 By Memory
8. Key Player Analysis
8.1 Samsung Electronics Co., Ltd.
8.1.1 Business Description
8.1.4 SWOT Analysis
8.1.5 Recent Developments
8.1.6 Analyst Overview
8.2 SK Hynix Inc.
8.3 Micron Technology, Inc
8.4 Nanya Technology Corporation
8.5 Winbond Electronics Corporation
8.6 Powerchip Technology Corporation
8.7 ADATA Technology Co. Ltd.
8.8 Ramaxel Technology (Shenzhen) Co, Ltd
8.9 Kingston Technology Corporation
8.10 SMART Modular Technologies
9. Market Outlook & Investment Opportunities
List of Tables
List of Figures
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