The global high bandwidth memory market is predicted to reach USD 1.57 billion in 2024 and USD 4.86 billion by 2029, growing at a CAGR of 25.4% during the forecast period.
High-bandwidth memory is a standardized stacked memory technology that offers extremely broad data channels inside the stack and between memory and logic. Up to eight DRAM modules can be connected by two channels per module in an HBM stack. Up to four chips can be used in current implementations, which essentially equals 40 DDR cores in a tenth of the size. The bandwidth between DRAM chips, the module and logic (interposer technology), and the tiny form factor compared to DRAM DIMMs make this technology appealing.
There is an increasing demand for HPC systems since they must analyze large amounts of data. The HPC market is expanding due to rising interest in big data and the rapid expansion of data centers. Furthermore, governments will likely make significant investments in the industry due to the rising demand for cost-effective and flexible solutions. A lack of stability in harsh environmental conditions restrains the market. Extreme environmental conditions have a substantial impact on memory device durability and reliability. For example, the more thermal stress a memory device is exposed to, the greater the danger of being damaged, making it difficult for a market to grow.
REPORT COVERAGE:
REPORT METRIC |
DETAILS |
Market Size Available |
2023 to 2029 |
Base Year |
2023 |
Forecast Period |
2024 to 2029 |
CAGR |
25.4% |
Segments Covered |
By Application, System, and Region |
Various Analyses Covered |
Global, Regional, & Country Level Analysis, Segment-Level Analysis, DROC, PESTLE Analysis, Porter’s Five Forces Analysis, Competitive Landscape, Analyst Overview on Investment Opportunities |
Regions Covered |
North America, Europe, APAC, Latin America, Middle East & Africa |
Market Leaders Profiled |
AMD (US), Micron (US), Intel (US), Xilinx (US), Open Silicon (US), Qualcomm (US), SK Hynix (South Korea), Fujitsu (Japan), Toshiba (US), STMicroelectronics (Switzerland) and Others. |
This research report on the global high bandwidth memory market has been segmented and sub-segmented based on the application, system, and region.
Global High-Bandwidth Memory Market - By Application:
The graphics segment will have the highest growth rate and market share—this market, which graphic card manufacturers back, will continue to rise gradually during the projection period.
Global High-Bandwidth Memory Market - By System:
On a single SoC, APUs combine GPU and CPU capabilities. It increases the overall energy efficiency of APUs by reducing connections between processors and processing speed due to a faster data transfer rate. As a result of the growing applicability in many industries, this drives market growth.
Global High-Bandwidth Memory Market – By Region:
The rapid adoption of HBM memories in North America is due to the rise of high-performance computing (HPC) applications requiring high-bandwidth memory solutions for fast data processing. The expanding market for AI, machine learning, and cloud computing is driving up demand for HPC in North America. By consolidating multiple data centers across the country, the US government has launched the Data Center Optimization Initiative (DCOI) to provide better services to the public while increasing taxpayer return on investment. The consolidation process comprises the creation of hyper-scale data centers and the decommissioning of underperforming ones. The government has shut down over 3,215 data centers across the country so far.
KEY MARKET PARTICIPANTS:
The major companies operating in the global high bandwidth market include AMD (US), Micron (US), Intel (US), Xilinx (US), Open-Silicon (US), Qualcomm (US), SK Hynix (South Korea), Fujitsu (Japan), Toshiba (US), and STMicroelectronics (Switzerland).
RECENT HAPPENINGS IN THE MARKET:
FAQ's
HBM finds widespread usage in sectors such as data centers, graphics, gaming, and networking. The data center segment, in particular, has emerged as a significant consumer due to the growing need for efficient and fast memory solutions.
HBM's high data transfer rates and low latency make it well-suited for handling the massive data requirements of AI applications, contributing to improved processing speeds and overall efficiency in AI computations.
While there are no specific global regulations governing HBM, compliance with industry standards and data protection regulations, especially in data-sensitive applications like finance and healthcare, can influence market dynamics.
The lifespan of HBM technology varies, but generally, new generations are introduced every few years. The industry has witnessed transitions from HBM1 to HBM2 and HBM2 to HBM2E, with ongoing research and development for future iterations.
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